AuthenX has many years of packaging experience in high-speed optical transceiver product development, including laser and photodiode precision positioning, flip-chip bonding, eutectic bonding, Sub-module optical lens assembly, active optical alignment technology, multi-channel optical fiber packaging and etc. Whether it is multi-mode or single-mode products, we have complete development experience from product development to mass production. 

Based on customer needs and products application, we can provide customized proposal to shorten the development time with high-precision, high-reliability products.